Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1976-04-12
1977-04-12
Tupman, W.
Metal working
Method of mechanical manufacture
Assembling or joining
29578, 357 15, 427 84, B01J 1700
Patent
active
040166430
ABSTRACT:
A high-frequency, high-power FET constructed upon a planar substrate with a repeated pattern of gate, source, and drain connections wherein any two are connected with metallization layers adjacent to and separated from the semiconductor substrate. The third element is interconnected with an overlay metallization layer separated from the lower two metallization layers by an insulating dielectric. The overlay layer is preferably grounded for minimum feedback capacitance.
REFERENCES:
patent: 3657615 (1972-04-01), Driver
patent: 3763408 (1973-10-01), Kano
patent: 3969745 (1976-07-01), Blocker
Benjamin James A.
Pucel Robert A.
Inge John R.
Martlett Milton D.
Pannone Joseph D.
Raytheon Company
Tupman W.
LandOfFree
Overlay metallization field effect transistor does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Overlay metallization field effect transistor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Overlay metallization field effect transistor will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1273571