Overlay measurement on double patterning substrate

Computer-aided design and analysis of circuits and semiconductor – Integrated circuit design processing – Physical design processing

Reexamination Certificate

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Reexamination Certificate

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07992115

ABSTRACT:
A method of measuring overlay between a first structure and a second structure on a substrate is provided. The structures include equidistant elements, such as parallel lines, wherein the equidistant elements of the first and second structure alternate. A design width CD1of the elements of the first structure is different from a design width CD2of the elements of the second structure. The difference in design width can be used to identify measurement points having incorrectly measured overlay errors.

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