Overlay mark for aligning different layers on a...

Details Overlay mark for aligning different layers on a... Overlay mark for aligning different layers on a...

2007-02-20

2007-02-20

Lauchman, Layla G. (Department: 2877)

Optics: measuring and testing

By alignment in lateral direction

With registration indicia

C257S797000, C430S022000

Reexamination Certificate

active

10702797

ABSTRACT:
The present invention provides an overlay mark for aligning different layers on a semiconductor wafer. The overlay mark comprises a bar-in-bar mark and two bar sets on the semiconductor wafer. The bar-in-bar mark comprises an inner bar mark positioned in one of the pre-layer and an outer bar mark positioned in the other pre-layer. The two bar sets are perpendicular to each other, and each of two bar sets comprises two parallel bars. The bars can be connected and the lengths of the bars can be the same or different.

REFERENCES:
patent: 6137578 (2000-10-01), Ausschnitt
patent: 6350548 (2002-02-01), Leidy et al.
patent: 6778275 (2004-08-01), Bowes
patent: 6801313 (2004-10-01), Yokota
patent: 2003/0174879 (2003-09-01), Chen

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