Overlay mark, and fabrication and application of the same

Details Overlay mark, and fabrication and application of the same Overlay mark, and fabrication and application of the same

2007-04-16

2011-10-04

Glick, Edward J (Department: 2882)

Photocopying

Projection printing and copying cameras

Methods

C355S053000, C355S055000

Reexamination Certificate

active

08031329

ABSTRACT:
An overlay mark is described, including a portion of a lower layer having two x-directional and two y-directional bar-like patterns therein, and two x-directional and two y-directional photoresist bars defined by the lithography process for defining an upper layer and surrounded by the bar-like patterns. At least one of the patterning process for defining the lower layer and the above lithography process includes two exposure steps respectively for defining a first device area and a second device area. When the patterning process includes two exposure steps, one x-directional and one y-directional bar-like patterns are defined simultaneously and the other x-directional and the other y-directional bar-like patterns are defined simultaneously. When the lithography process includes two exposure steps, one x-directional and one y-directional photoresist bars are defined simultaneously and the other x-directional and the other y-directional photoresist bars are defined simultaneously.

REFERENCES:
patent: 5635336 (1997-06-01), Bae
patent: 5952132 (1999-09-01), King et al.
patent: 6612159 (2003-09-01), Knutrud
patent: 6809420 (2004-10-01), Wong
patent: 2002/0005594 (2002-01-01), Iwamatsu

Affiliated with

Also associated with

Rating

Overlay mark, and fabrication and application of the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Overlay mark, and fabrication and application of the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Overlay mark, and fabrication and application of the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4295180