Optics: measuring and testing – By alignment in lateral direction – With registration indicia
Patent
1996-07-12
2000-02-08
Font, Frank G.
Optics: measuring and testing
By alignment in lateral direction
With registration indicia
G01B 1127
Patent
active
060233389
ABSTRACT:
The present invention is a new target, and associated apparatus and methods, for determining offset between adjacent layers of a semiconductor device. The target disclosed here includes a first periodic structure to be placed on a first layer of the device and a second periodic structure, that complements the first periodic structure, placed on a second layer of the device at a location that is adjacent the first periodic structure when the second layer is placed on the first layer. Any offset that may occur is detected by the present invention either optically, micro-mechanically or with electron beams using any of various methods and system embodiments.
REFERENCES:
patent: 4480916 (1984-11-01), Bareket et al.
patent: 4815854 (1989-03-01), Tanaka et al.
patent: 4820055 (1989-04-01), Muller
patent: 4962318 (1990-10-01), Nishi
patent: 5172190 (1992-12-01), Kaiser
patent: 5235408 (1993-08-01), Matsugu et al.
patent: 5343292 (1994-08-01), Brueck et al.
patent: 5408320 (1995-04-01), Katagiri et al.
patent: 5414514 (1995-05-01), Smith et al.
patent: 5418613 (1995-05-01), Matsutani
patent: 5477057 (1995-12-01), Angeley et al.
Mask-to-Mask alignment and copying, IBM Technical Disclosure Bulletin, vol. 16, No. 6, p. 1977-78. Nov. 1973.
Modern Optical Engineering, The Design of Optical Systems, Warren J. Smith, (1990) 2nd Ed., pp. 151-154.
Handbook of Critical Dimension Metrology and Process Control, Kevin M. Monahan, editor, (1994) vol. CR52, pp. 160-188.
Font Frank G.
Jones Allston L.
Smith Zandra V.
LandOfFree
Overlay alignment measurement of wafers does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Overlay alignment measurement of wafers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Overlay alignment measurement of wafers will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1685394