Overlapping electrode structure for solid state devices

Details Overlapping electrode structure for solid state devices Overlapping electrode structure for solid state devices

1977-06-14

1978-11-07

Tupman, W.

Metal working

Method of mechanical manufacture

Assembling or joining

29580, 29590, 29591, 357 24, B01J 1700

Patent

active

041238346

ABSTRACT:
A method for making an overlapping electrode structure on an insulation layer comprising selectively etching a conducting layer on the insulation layer to form channels which are oxidized to form conducting ribbons surrounded by an insulating blanket. Contact windows are then opened in selected areas of the insulating blanket such that a conducting material cooperates with the conducting ribbons to form the overlapping electrode structure. In an alternative method, a bilayer structure comprising layers of first and second etching materials is formed on the insulating layer. Channels are then etched in selected portions of the bilayer structure and etch stops are formed along one side wall of the channel through the bilayer structure. The exposed surfaces of the insulation layer and first etching material are then simultaneously etched to form a sloped area in the surface of the insulation layer as a consequence of differential etching rates of the insulation layer and the first etching material. The remaining etch stops are then partially oxidized to form conducting ribbons which are electrically isolated by an insulating blanket. Contact windows are opened in selected areas of the insulating blanket. A conducting material is provided to the exposed surfaces of the insulation layer, the conducting ribbon and selected areas of exposed surfaces of the insulating blanket to provide the overlapping electrode structure on the insulation layer.

REFERENCES:
patent: 3793090 (1974-02-01), Barile
patent: 4016587 (1977-04-01), De La Moneda

Affiliated with

Also associated with

Rating

Overlapping electrode structure for solid state devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Overlapping electrode structure for solid state devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Overlapping electrode structure for solid state devices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2228163