Overlapped color filter fabrication technique

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation

Reexamination Certificate

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C430S007000, C430S293000

Reexamination Certificate

active

11280323

ABSTRACT:
A solid state image pickup element which can exponentially reduce the in-plane photoelectric conversion portion characteristic distribution created in forming color filters by a common photolithography technique and which, when color filters are formed by split exposure, can reduce image non-uniformity between exposure regions in a picked-up image, and a method of manufacturing the same. The method includes: applying negative type color resist for forming first color filters onto an entire surface of a given film; forming the first color filters by irradiation of given portions with exposure light and subsequent development; applying negative type color resist for forming second color filters onto the entire surface of the first color filters while covering the first color filters; and forming the second color filters by irradiating an area smaller than a region that is surrounded by the first color filters with exposure light and subsequent development.

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patent: 5561317 (1996-10-01), Momma et al.
patent: 5568293 (1996-10-01), Takao et al.
patent: 5731131 (1998-03-01), Momma et al.
patent: 6630722 (2003-10-01), Aoki
patent: 2002/0045111 (2002-04-01), Machiguchi et al.
patent: 05-006849 (1998-01-01), None
patent: 10/209410 (1998-08-01), None

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