Electricity: circuit makers and breakers – Solid contact – Membrane type
Reexamination Certificate
2007-12-13
2008-10-14
Friedhofer, Michael A (Department: 2832)
Electricity: circuit makers and breakers
Solid contact
Membrane type
C029S622000
Reexamination Certificate
active
07435922
ABSTRACT:
Described is a keypad and its method of manufacture. In one embodiment, a keypad is provided that includes a substrate having a plurality of donut-shaped recesses located at each site of a button for inputting user information, a plurality of cushions each filled with an incompressible fluid (e.g., water), a flex circuit layer, a plurality of metal membranes and an over-molded thermoplastic elastomer layer. During the over-molding of the thermoplastic elastomer layer, the plurality of cushions filled with an incompressible fluid prevents collapse of the space between the flex circuit layer and the plurality of metal membranes. After the layers of the keypad are assembled, the incompressible fluid is removed which leaves a space between the flex circuit layer and the plurality of metal membranes.
REFERENCES:
patent: 4046981 (1977-09-01), Johnson et al.
patent: 4194097 (1980-03-01), Bradam
patent: 4349712 (1982-09-01), Michalski
patent: 4471176 (1984-09-01), Inaba
patent: 5089671 (1992-02-01), Ranetkins
patent: 5298706 (1994-03-01), English et al.
patent: 6768074 (2004-07-01), Iwama
patent: 7015408 (2006-03-01), Hirahata et al.
patent: 7094985 (2006-08-01), Kobayashi et al.
patent: 7350285 (2008-04-01), Mitsuoka et al.
Barrella John
Wittig J. Michael
Animas Corporation
Friedhofer Michael A
Jaeschke, Jr. Wayne C.
LandOfFree
Over-molded keypad and method of manufacture does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Over-molded keypad and method of manufacture, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Over-molded keypad and method of manufacture will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4002288