Incremental printing of symbolic information – Ink jet – Fluid or fluid source handling means
Reexamination Certificate
2007-01-30
2011-11-29
Martin, Laura (Department: 2853)
Incremental printing of symbolic information
Ink jet
Fluid or fluid source handling means
C347S084000, C347S086000
Reexamination Certificate
active
08066358
ABSTRACT:
A fluid interconnect for a fluid enclosure includes an overmolded sealing surface of a thermoplastic elastomeric material, the sealing surface having an opening, the sealing surface overmolded upon a thermoplastic surface of a fluid enclosure; and a wall of the thermoplastic elastomeric material connected to the sealing surface, the wall enclosing a pathway, the pathway communicating with the opening at a first end; and a layer connected to the wall, the layer closing the pathway at a second end.
REFERENCES:
patent: 6422693 (2002-07-01), Pawlowski, Jr. et al.
patent: 6644796 (2003-11-01), Olsen
patent: 6648458 (2003-11-01), Dod et al.
patent: 6692118 (2004-02-01), Michele et al.
patent: 6702434 (2004-03-01), Barinaga et al.
patent: 6739709 (2004-05-01), Nip
patent: 6824139 (2004-11-01), Barinaga et al.
patent: 6916088 (2005-07-01), Smith et al.
patent: 6948801 (2005-09-01), Rehman et al.
patent: 6964473 (2005-11-01), Martin
patent: 7025448 (2006-04-01), Olsen
patent: 2002/0122104 (2002-09-01), Hatasa et al.
patent: 2002/0149646 (2002-10-01), Pawlowski et al.
patent: 2004/0001127 (2004-01-01), Nip
patent: 2006/0017790 (2006-01-01), Jin
International Search Report for Application PCT/US2008/051265. Report issued Apr. 29, 2008.
Liddell Garry P.
Lunceford Steven
Ogle Holli C.
Stathem Ralph L.
Hewlett--Packard Development Company, L.P.
Martin Laura
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