Over-molded fluid interconnect

Incremental printing of symbolic information – Ink jet – Fluid or fluid source handling means

Reexamination Certificate

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C347S084000, C347S086000

Reexamination Certificate

active

08066358

ABSTRACT:
A fluid interconnect for a fluid enclosure includes an overmolded sealing surface of a thermoplastic elastomeric material, the sealing surface having an opening, the sealing surface overmolded upon a thermoplastic surface of a fluid enclosure; and a wall of the thermoplastic elastomeric material connected to the sealing surface, the wall enclosing a pathway, the pathway communicating with the opening at a first end; and a layer connected to the wall, the layer closing the pathway at a second end.

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patent: 2006/0017790 (2006-01-01), Jin
International Search Report for Application PCT/US2008/051265. Report issued Apr. 29, 2008.

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