Oven for the burn-in of integrated circuits

Details Oven for the burn-in of integrated circuits Oven for the burn-in of integrated circuits

1987-05-21

1989-11-21

Ford, John F.

Heat exchange

Movable heating or cooling surface

Rotary drum

165 27, 165 61, 165 63, 165 64, 364557, 324 73R, 324 73PC, 324158R, 324158F, 219494, 219497, 219210, F25B 2900, G01R 1512

Patent

active

048815918

ABSTRACT:
Over for the burn-in of integrated circuits (12), comprising: a chamber (B) for receiving such circuits (12); first means (4), for heating such integrated circuits (12) in the chamber (B) with the circuits (12) fed with supply voltages; and control means for controlling the first means (4), including a computer (15) for monitoring power consumed by the circuits (12), the computer (15) being capable of storing information concerning the number of said circuits (12) and being adapted to provide from said power, a signal dependent on the mean power dissipation of the circuits (12): and in which oven the control means controls the heating of the circuits (12) in dependence on said signal. Also disclosed is an oven for the burn-in of integrated circuits (12), the oven comprising: a plurality of separate chambers (B) for receiving such circuits (12) to be burned-in with the circuits (12) fed with supply voltages; first means (4) for heating separately each of the chambers; and second means (6) for cooling separately each of the chambers with its circuits (12) therein, after they have been burned-in and with the circuits (12) still being fed supply voltages.

REFERENCES:
patent: 3143167 (1964-08-01), Vieth
patent: 3360032 (1967-12-01), Sherwood
patent: 3724536 (1973-03-01), Baxter
patent: 3842346 (1974-10-01), Bobbitt
patent: 4145620 (1979-03-01), Dice
patent: 4572283 (1986-02-01), Vander Schaaf
patent: 4573011 (1986-02-01), Rochat et al.
patent: 4695707 (1987-09-01), Young
patent: 4734872 (1988-03-01), Eager et al.
IBM Technical Disclosure Bulletin, Module Thermal Test Chamber, vol. 24, No. 9, Feb. 1982, pp. 4650-4651.

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