Oven for semiconductor wafer

Details Oven for semiconductor wafer Oven for semiconductor wafer

2008-01-31

2011-12-06

Robinson, Daniel L (Department: 3742)

Electric resistance heating devices

Heating devices

Radiant heater

C118S725000

Reexamination Certificate

active

08073316

ABSTRACT:
An oven is described that can more evenly heat the semiconductor wafer, even though the wafer may warp during heating. The oven may provide relatively uniform heating even though the type and location of warping may be unpredictable for any given wafer. The oven may have a heating surface divided into a plurality of heating zones that may each independently provide a given amount of heat to the wafer. The amount of heat provided by each zone may be determined using signals from sensors that sense the warping of the wafer.

REFERENCES:
patent: 6002109 (1999-12-01), Johnsgard et al.
patent: 6043460 (2000-03-01), Johnsgard et al.
patent: 6172337 (2001-01-01), Johnsgard et al.
patent: 6191394 (2001-02-01), Shirakawa et al.
patent: 6403925 (2002-06-01), Johnsgard et al.
patent: 6403933 (2002-06-01), Strodtbeck et al.
patent: 2007/0125762 (2007-06-01), Cui et al.
patent: 2001274069 (2001-10-01), None

Affiliated with

Also associated with

Rating

Oven for semiconductor wafer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Oven for semiconductor wafer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Oven for semiconductor wafer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4254184