Oven for reflowing circuit board assemblies and method therefor

Details Oven for reflowing circuit board assemblies and method therefor Oven for reflowing circuit board assemblies and method therefor

1997-05-06

1999-10-26

Heinrich, Samuel M.

Metal fusion bonding

Means to apply vibratory solid-state bonding energy to work

126 21A, B23K 300

Patent

active

059712465

ABSTRACT:
An oven (100) for reflowing circuit board assemblies (102). Air is pumped into a heating chamber (104) from which the air is then communicated through one or more apertures (112) in a panel (114) to a reflow chamber (106). A conveyor track (108) conveys the assemblies (102) through the reflow chamber (106). In use, the oven turbulates the air sufficient to vibrate components on the assemblies (102) and, thereby, realigns components inadvertently displaced off pads of the assemblies (102).

REFERENCES:
patent: 4363434 (1982-12-01), Flury
patent: 4885841 (1989-12-01), McNabb
patent: 5230460 (1993-07-01), Deamborsio et al.
patent: 5678752 (1997-10-01), Kaminsky et al.

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