Oven for controlled heating of compounds at varying...

Details Oven for controlled heating of compounds at varying... Oven for controlled heating of compounds at varying...

2008-07-22

2008-07-22

Pelham, Joseph M (Department: 3742)

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

C219S411000, C392S418000, C118S724000, C118S729000

Reexamination Certificate

active

07402778

ABSTRACT:
An oven is provided for curing or reflowing compounds on objects, such as lead frames or other substrates. The oven comprises a heating chamber, a heating assembly mounted in thermal communication with the heating chamber to provide heat thereto, and a support assembly for supporting the object in the heating chamber for heating. The heating assembly and support assembly are configured to be movable relative to one another for controllably positioning the object at variable distances with respect to the heating assembly. Heating of the object according to a heating profile can thus be achieved by controlled heating of the object at different temperatures by positioning the object at different distances with respect to the heating assembly during the heating process although there is a single heating zone.

REFERENCES:
patent: 5367606 (1994-11-01), Moslehi et al.
patent: 5662469 (1997-09-01), Okase et al.
patent: 5710407 (1998-01-01), Moore et al.
patent: 5892886 (1999-04-01), Sandhu
patent: 5910218 (1999-06-01), Park et al.
patent: 6300600 (2001-10-01), Ratliff et al.
patent: 6492621 (2002-12-01), Ratliff et al.
patent: 6508885 (2003-01-01), Moslehi et al.
patent: 6610968 (2003-08-01), Shajii et al.
patent: 6998580 (2006-02-01), Kusuda et al.
patent: 2004/0060917 (2004-04-01), Liu et al.
patent: 2005/0022741 (2005-02-01), Seo et al.
patent: 2006/0180082 (2006-08-01), Iwamoto et al.
patent: 2317497 (1998-03-01), None
patent: 08-236920 (1996-09-01), None

Affiliated with

Also associated with

Rating

Oven for controlled heating of compounds at varying... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Oven for controlled heating of compounds at varying..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Oven for controlled heating of compounds at varying... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2774543