Outer lead tape automated bonding system

Metal fusion bonding – Process – Plural joints

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Details

228212, 228223, 228175, 29834, B23K10140, H05K 334, H01L 2158

Patent

active

049796631

ABSTRACT:
A method for aligning and bonding the outer leads of the conductive fingers of a tape-and-semiconductor-chip sub-assembly to a package substrate is disclosed. Each section of tape is provided with an inner support ring and an outer support ring. The conductive fingers extend from under the inner support ring to under the outer support ring. The outer support ring is spaced away from the inner support ring to expose portions of the tape outer leads therebetween. The tape-and-chip sub-assembly is positioned over the package substrate so the outer leads are in register with the appropriate package substrate leads. A deposit of flux is applied to at least one location between the substrate and outer support ring to bond the sub-assembly to the substrate. The bonded outer support ring prevents the sub-assembly from moving so the leads do not become out of register with the substrate prior to and during the lead bonding process.

REFERENCES:
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patent: 4604644 (1986-08-01), Beckham et al.
patent: 4645114 (1987-02-01), Van Den Brekel et al.
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IBM Technical Disclosure Bulletin, vol. 28, No. 5, Oct. 1985, pp. 2237-2238, Armonk, N.Y., U.S.; "Outer lead guard bars for tab".
Patent Abstracts of Japan, vol. 9, No. 143, (E-322) [1866] JA-60-25263, Lead Frame, 6-18-1985.

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