Outer lead forming apparatus for semiconductor device

Details Outer lead forming apparatus for semiconductor device Outer lead forming apparatus for semiconductor device

1991-02-27

1992-08-04

Larson, Lowell A.

Wireworking

Crimping

B21F 4500

Patent

active

051350343

ABSTRACT:
An outer lead forming apparatus for a semiconductor device, includes a first die block incorporating dies for performing punching steps of a lead frame, a second die block incorporating dies for performing bending steps of leads, and convey means for conveying a workpiece from the first die block to the second die block.

REFERENCES:
patent: 4829669 (1989-05-01), Nakajima
patent: 4875279 (1989-10-01), Sakiadis

Affiliated with

Also associated with

Rating

Outer lead forming apparatus for semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Outer lead forming apparatus for semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Outer lead forming apparatus for semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-772542