Outer lead bonding head and method of bonding outer lead

Details Outer lead bonding head and method of bonding outer lead Outer lead bonding head and method of bonding outer lead

1990-12-13

1992-05-19

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

29740, 29741, 29743, 228 62, 2281802, H05K 330, H05K 334

Patent

active

051135817

ABSTRACT:
A nozzle shaft is moved down, and a semiconductor chip sucked to the lower end of the nozzle shaft is placed on a circuit board. Then, a thermally press-bonding member is moved down, and the outer leads of the semiconductor chip are pressed to the circuit board by the thermally press-bonding member. Thereafter, the thermally press-bonded member is pressed by pressing means to strongly press the outer leads to the circuit board, the thermally press-bonding member is then raised to release the pressing state, and the outer leads are thermally press-bonded to the circuit board.

REFERENCES:
patent: 3883945 (1975-05-01), Wallis
patent: 4300715 (1981-11-01), Keizer et al.
patent: 4787548 (1988-11-01), Abbagnaro et al.
patent: 4979664 (1990-12-01), Lyons et al.

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