Outer lead bonding device utilizing tape carriers

Details Outer lead bonding device utilizing tape carriers Outer lead bonding device utilizing tape carriers

1988-06-22

1989-05-02

Godici, Nicholas P.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

With means to treat workpieces

228 62, 228 151, 228 447, 29835, B23K 120

Patent

active

048260681

ABSTRACT:
A bonding device for effecting outer lead bonding is disclosed which comprises a bonding stage, a pair of bonding tools, and lead supporting means. The lead supporting means may take the form of a pair of projections formed on the upper surface of the bonding stage at horizontal locations thereof which are situated below the lead supporting portion of the tape carrier. Alternatively, the lead supporting means may take the form of a pair of horizontally extending rectangular columns which are retractably inserted into the above specified horizontal locations of the upper surface of the bonding stage. Thus, leads can be formed simultaneously with the outer lead bonding. The bonding stage may be divided into upper and lower stages, and the projections may be formed on the upper surface of the lower stage to extend through holes formed in the upper stage. This structure makes the projections retractable.

REFERENCES:
patent: 4378902 (1983-04-01), Fedak

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