Outer-lead bonding apparatus and method therefor

Details Outer-lead bonding apparatus and method therefor Outer-lead bonding apparatus and method therefor

1994-09-01

1996-03-26

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29739, 29759, 22818021, H01R 4306, B23P 1900

Patent

active

055010040

ABSTRACT:
An outer lead bonding apparatus and method bonds an outer lead of a tape carrier package to an electrode formed on a display panel. During the observation stage when positional deviations between the outer lead and electrode are detected and corrected, a pressing member presses on the outer lead to remove any warp or bend in the outer lead. The electrode includes anisotropic conductive tape which is inherently adhesive. To prevent unwanted movement of the tape carrier package during the observation and positioning process by premature sticking of the outer lead to the tape on the electrode, the tape carrier package is sandwiched firmly in place.

REFERENCES:
patent: 3774834 (1973-11-01), Holler et al.
patent: 3949925 (1976-04-01), Keizer et al.
patent: 4967261 (1990-10-01), Niki et al.
patent: 5177596 (1993-01-01), Muramatsu et al.
patent: 5276961 (1994-01-01), Matta et al.

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