Outer lead bonding apparatus and method of bonding lead to subst

Details Outer lead bonding apparatus and method of bonding lead to subst Outer lead bonding apparatus and method of bonding lead to subst

1995-11-20

1999-01-05

Lorin, Francis J.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With work feeding or handling means

156540, 29741, H05K 332

Patent

active

058557326

ABSTRACT:
The invention provides an outer lead bonding apparatus for bonding a plurality of leads extending outwardly of a semiconductor chip to bonding pads mounted on a substrate, the apparatus including (a) a bonding-aid member having a central portion and a marginal portion, the semiconductor chip being to be adhered to a lower surface of the central portion of the bonding-aid member, the bonding-aid member being to be adhered at the marginal portion thereof to the substrate, the bonding-aid member being formed with an opening for exposing distal ends of the leads at which the leads are to be bonded to the bonding pads, (b) a device for ascertaining whether the leads align with the bonding pads, and (c) a bonding tool having compressing portions for compressing the leads to the bonding pads, the compressing portions having a cross-section to be able to pass through the opening of the bonding-aid member. The invention makes it possible to avoid misalignment of the leads of a semiconductor chip to the bonding pads by simpler arrangement than prior apparatuses.

REFERENCES:
patent: 5231753 (1993-08-01), Tanaka et al.
patent: 5249356 (1993-10-01), Okuda et al.

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