Outer lead bonding apparatus

Details Outer lead bonding apparatus Outer lead bonding apparatus

1993-11-12

1994-08-30

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29739, 29740, 29741, 29832, 29833, 29834, 156235, 156355, 156362, 156538, B32B 3100

Patent

active

053424603

ABSTRACT:
An outer lead bonding apparatus which includes a device supply section on which devices are arranged at predetermined positions, a transfer head assembly for picking up the devices from the device supply section, means for driving the transfer head assembly in a predetermined direction, a first monitoring camera for checking the devices picked up by the transfer head assembly for its positional exactness, a substrate driving means for moving the substrate in a predetermined direction, and a second monitoring camera for checking the electrodes of the substrate for their positional exactness.

REFERENCES:
patent: 3909933 (1975-10-01), Doubek, Jr. et al.
patent: 4526646 (1985-07-01), Suzuki et al.
patent: 4675993 (1987-06-01), Harada
patent: 4858308 (1989-08-01), Komori
patent: 4868977 (1989-09-01), Maruyama et al.
patent: 4868978 (1989-09-01), Seidel et al.
patent: 4896418 (1990-01-01), Yearsley

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