Outer lead bending apparatus for a semiconductor package device

Details Outer lead bending apparatus for a semiconductor package device Outer lead bending apparatus for a semiconductor package device

1994-02-09

1995-11-21

Larson, Lowell A.

Wireworking

Crimping

B21F 100

Patent

active

054678030

ABSTRACT:
An outer lead bending apparatus comprises a fixed unit, a movable unit movable toward and away from the fixed unit, a first die detachably mounted on one of the fixed unit and movable unit and holding a semiconductor package devise in place, and a second die detachably mounted on the other unit and, when the movable unit is driven toward the fixed unit, bending, together with the first die, the outer leads of the semiconductor package devise into a given configuration.

REFERENCES:
patent: 3796201 (1974-03-01), Golub
patent: 3903934 (1975-09-01), Vizy
patent: 4064917 (1977-12-01), Diaz
patent: 4620572 (1986-11-01), Baker et al.
patent: 5070916 (1991-12-01), Biesecker
patent: 5273081 (1993-12-01), Maksim

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