Outer bonding tool for tape carrier and method of producing semi

Details Outer bonding tool for tape carrier and method of producing semi Outer bonding tool for tape carrier and method of producing semi

1992-06-09

1993-12-21

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

219 8516, 219 8518, H01R 4300, B23K 102

Patent

active

052711471

ABSTRACT:
An outer bonding tool is used for bonding outer leads of a tape carrier on corresponding pads which are formed on a circuit substrate by solder after bonding inner leads of the tape carrier and electrodes of a generally rectangular semiconductor chip. The outer bonding tool includes a main body having a bottom surface, a pressing surface provided at the bottom surface of the main body for pressing against the outer leads of the tape carrier, where the pressing surface has a generally rectangular frame shape, and a groove formed in the pressing surface and extending generally perpendicularly to a corresponding group of outer leads extending from one side of the semiconductor chip. A width of the groove taken in a direction in which the corresponding group of outer leads extend is smaller than a length of the outer leads.

REFERENCES:
patent: 4855559 (1989-08-01), Donner
patent: 4894506 (1990-01-01), Woerner
patent: 5066844 (1991-11-01), Schuster et al.
patent: 5080279 (1992-01-01), Davison
patent: 5098008 (1992-03-01), Viza et al.
patent: 5142450 (1992-08-01), Olson et al.
IBM Technical Disel Bull vol 18 No 12 May 1976 p. 3984, by E. C. Baldwin et al.
IBM Technical Disel Bull vol 22 No 1 Jun. 1979 pp. 69-70 by Houser.

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