Oscillator package

Details Oscillator package Oscillator package

1991-07-24

1993-04-27

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 524, 174 525, 361390, 257924, H05K 500, H01L 2302

Patent

active

052064603

ABSTRACT:
An oscillator package includes a header substrate with a number of through holes formed therein, a copper post passed through each through hole, a ceramic substrate securely mounted to and supported by the copper posts for mounting a die and a crystal thereon, a substantially L-shaped lead securely attached to an underside as well as a lateral side of the header substrate and contacting each copper post, and a ceramic cover housing the die and crystal. A metal film is applied to an inner periphery of the hole, and the copper posts are mounted in the holes after the metal-film is sintered. An outer periphery of the copper post is plated by nickel then gold. The lead is mountable to a circuit board by soldering, and the solder covers an overall area of the lead. The ceramic cover has at least a 90% weight of aluminum oxide.

REFERENCES:
patent: 4152616 (1979-05-01), Ozbirn et al.
patent: 4208698 (1980-06-01), Narasimhan
patent: 4338621 (1982-07-01), Braun
patent: 4382327 (1983-05-01), Bardens et al.
patent: 4951011 (1990-08-01), Heckaman et al.
patent: 5018004 (1991-05-01), Okinaga et al.
patent: 5093282 (1992-03-01), Ohno et al.

Affiliated with

Also associated with

Rating

Oscillator package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Oscillator package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Oscillator package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2329091