Oscillators – Solid state active element oscillator – Significant distributed parameter resonator
Reexamination Certificate
2001-10-12
2003-06-24
Kinkead, Arnold (Department: 2817)
Oscillators
Solid state active element oscillator
Significant distributed parameter resonator
C331S03600C, C331S17700V, C331S096000, C331S1070DP
Reexamination Certificate
active
06583677
ABSTRACT:
CROSS-REFERENCE TO RELATED APPLICATION
This application is related to Japanese patent application No. 2000-311612, whose priority is claimed under 35 USC §119, the disclosure of which is incorporated by reference in its entirety.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an oscillator and a method for adjusting oscillation characteristics of the oscillator. More specifically, the present invention relates to a small oscillator used in mobile telephones, mobile data terminals, wireless LAN transmitter/receivers, satellite communications terminals, GPS receivers and other types of wireless communication devices operating at a high frequency band, and to a method for adjusting the oscillation characteristics of the oscillator. An oscillator according to this invention is well suited to reducing the size of a module that is a major component of the oscillator used particularly in a high frequency band operating at hundreds of megahertz and higher.
2. Description of Related Art
As terminal devices for high frequency communication systems, such as mobile telephones, have gotten smaller, so have oscillation circuit modules, such as voltage control oscillators (VCO), which are one kind of high frequency components used in such terminal devices.
The characteristics of individual components and variations in wiring pattern dimensions in substrates cannot be ignored in such small oscillation modules for high frequency applications, particularly at frequencies of hundreds of megahertz and higher. It is therefore necessary in practice to adjust each individual module so that the oscillation frequency, for example, is within a specific design range.
One method used for this adjustment as taught in Japanese Unexamined Patent Publication HEI6 (1994)-13807 is to adjust an inductor part of an oscillation circuit by changing the length and/or width of a conductor pattern. This is accomplished by cutting a part of a circuit pattern formed on a component mounting surface of a circuit board by mechanical means, such as a sandblasting machine, or optical means, such as a laser beam. Other methods seeking to achieve an even smaller module by means of a multilayer circuit board provide a part of an inductor (see Japanese Patent No. 2662748) or capacitor (see Japanese Patent No. 2531000) of the oscillation circuit in the circuit board layers.
FIGS. 10 and 11
show an exemplary oscillator in which an inductor part of an oscillator is drawn to a circuit board surface. As shown in
FIG. 10
, a back ground conductor
22
, an internal ground conductor
23
and an inductor conductor
24
of a strip line between the conductors
22
and
23
are formed within a printed circuit board
21
, forming a tri-plate structure. A part
24
a
of the strip line inductor conductor is connected through a through hole
25
to a conductor pad
24
b
mounted on the substrate surface. The electrical length of the inductor can then be changed by appropriately trimming this surface conductor pad
24
b
on the substrate surface as shown at notches
26
in
FIG. 11
, thereby adjusting inductance L to vary oscillator characteristics such as oscillation frequency.
Another adjustment method is illustrated in FIG.
12
. As shown in this section view of an oscillator, a capacitor of the oscillator is formed inside a substrate, and one electrode of the capacitor electrode disposed on the substrate surface is trimmed to adjust capacitance as a means of adjusting oscillator characteristics. In this example, an inductor of a resonance circuit is incorporated as a strip line
24
of the tri-plate structure inside a printed circuit board
21
as in the above example, and one end of the inductor is exposed via a through hole
25
on to the substrate surface as a surface electrode
28
. That is, a capacitor
27
of a resonance circuit parallel-connected to the inductor is mounted within the circuit board with the surface electrode
28
opposed to the internal ground conductor
23
with the intervention of the dielectric circuit board. The surface electrode
28
is trimmed to adjust the electrode surface area, and thereby adjust capacitance, that is, adjust the oscillator.
In the above-described prior-art examples, while a part of the circuit is formed inside the circuit board so as to reduce device dimensions, both of the methods also expose a part of the internal conductor pattern on the component mounting surface of the circuit board so that the exposed part (part
24
b
in FIG.
10
and part
28
in
FIG. 12
) is trimmed, to adjust oscillator module characteristics. This method of internalizing a part of the circuit as a means of reducing size is therefore the same as methods in which parts are not internalized in that a trimming pad occupies a certain amount of area on the component mounting surface.
A metal shield cap covering the component mounting surface is provided for most such modules to protect the mounted components and prevent electromagnetic interference with neighboring parts. This shield cap can be mounted either before or after adjusting the oscillator. When the shield cap is installed after trimming a circuit component on the component mounting surface of the circuit board to adjust the oscillator, the adjustment must be accomplished to anticipate any shift in characteristics resulting from the later addition of the shield cap. If the shield cap is installed before the adjustment, a laser can be used for trimming through a trimming slit or hole provided in the shield cap, and the trimming slit or hole is then sealed with a conductive sealant.
In the former method, trimming must allow for any shift in the oscillator frequency or other module characteristics resulting from the addition of the shield cap. As noted above, however, since variations in characteristics of individual modules are great, the adjustment is not possible with a uniform offset, and the precise adjustment is not possible with this method. In the latter method, dust and debris from the trimmed part become trapped inside the shield cap because trimming is accomplished after the shield cap is mounted. Such dust and debris can easily adhere to surrounding parts, resulting in a possible loss of reliability.
One possible method of resolving this problem is to draw an internal conductor to the back side of a circuit board for trimming. In this case, however, a trimming pad must be provided, and this occupies some area on the back of the circuit board. This makes it difficult to shield the back of a module. A shield cap such as provided on the front surface of the circuit board must therefore be provided. This method is therefore not practical for applications seeking to downsize the module.
Another oscillator adjustment method proposing a solution to this problem is taught in Japanese Unexamined Patent Publication HEI9 (1997)-153737. This method accomplishes laser trimming perpendicular from the back of a circuit board to the inside to adjust electrode area of a multilayer internal capacitor.
FIG. 13
is a section view of a module in this method. In this module a capacitor
27
of a resonance circuit is internalized in a circuit board by stacking electrodes
27
a
and
27
b
with a dielectric layer of the circuit board therebetween. As indicated by an arrow
28
in
FIG. 14
, laser trimming perpendicular to and from the back of the module adjusts the area of the electrodes
27
a
and
27
b
of the internal capacitor
27
, and thus adjusts the module.
While this method solves the surface area problem described above, an electrode structure of a capacitor must be a multilayer structure comprising at least three or four layers in order to achieve a sufficient capacitance adjustment range. This results in a multilayer circuit board, increasing circuit board thickness and cost.
The inventors of the present invention have been provided another solution to the above-mentioned problems as disclosed in Japanese Unexamined Patent Publication No. 2001-007642 (hereinafter it is referred to as a preceding application). In this met
Otsuki Terukazu
Shintani Jun
Kinkead Arnold
Sharp Kabushiki Kaisha
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