Orthopaedic component manufacturing method and equipment

Abrading – Precision device or process - or with condition responsive... – Computer controlled

Reexamination Certificate

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C451S060000

Reexamination Certificate

active

07959490

ABSTRACT:
A system for use in preparing an articulating surface of a component of an orthopaedic implant is provided. The system includes a magnetorheological polishing fluid including a carrier fluid and a plurality of particles suspendable in said carrier fluid. The system also includes a vessel for containing the Magnetorheological polishing fluid. The system also includes a mechanism for delivering the fluid to form a polishing zone and a holder for securing the component and for moveably positioning the articulating surface of the component relative to the polishing zone. The system further includes a controller for determining the rate of material removal from the object, for determining the direction and velocity of movement of the polishing zone relative to the object and for determining the number of cycles of polishing required.

REFERENCES:
patent: 5449313 (1995-09-01), Kordonsky et al.
patent: 5616066 (1997-04-01), Jacobs et al.
patent: 5690284 (1997-11-01), Murray
patent: 5951369 (1999-09-01), Kordonski et al.
patent: 5971835 (1999-10-01), Kordonski et al.
patent: 6106380 (2000-08-01), Jacobs et al.
patent: 6267651 (2001-07-01), Kordonski et al.
patent: 6332829 (2001-12-01), Trommer
patent: 6402978 (2002-06-01), Levin
patent: 6413441 (2002-07-01), Levin
patent: 6503414 (2003-01-01), Kordonsky et al.
patent: 6506102 (2003-01-01), Kordonski et al.
patent: 6561874 (2003-05-01), Kordonski
patent: 6719611 (2004-04-01), Kordonski et al.
patent: 6746310 (2004-06-01), Tricard et al.
patent: 6776688 (2004-08-01), Kim et al.
patent: 6893322 (2005-05-01), Kordonski et al.
patent: 6955589 (2005-10-01), Kordonski et al.
patent: 6956657 (2005-10-01), Golini et al.
patent: 7156724 (2007-01-01), Kordonski et al.
patent: 7173691 (2007-02-01), Murphy et al.
patent: 7261616 (2007-08-01), Kordonsky et al.
patent: 7297290 (2007-11-01), Fuchs et al.
patent: 7433057 (2008-10-01), Murphy et al.
patent: 2003/0087585 (2003-05-01), Kordonsky et al.
patent: 2004/0192171 (2004-09-01), Koike
patent: 2004/0266319 (2004-12-01), Kordonski et al.
patent: 2005/0079812 (2005-04-01), Bechtold
Tricard et al.,Sub-Aperture Approaches for Asphere Polishing and Metrology, Invited Talk, Photonics Asia (Nov. 8-11, 2004) (16 pages).
M.R. Oliver,Chemcal-Mechanical Planarization of Semiconductor Material, Springer-Verlag Berlin Heidelberg (2004).
Internet article entitled “Microwave Plasma Synthesis of Encapsulated Metal Nanopowders” by Joseph Lik Hang Chau; published at least as early as Sep. 28, 2006; 2 pages.
Internet pages or brochure from QED Technologies entitled “Technology, How It Works”; published at least as early as Sep. 28, 2006; 3 pages.

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