Orthogonal bonding method and equipment

Details Orthogonal bonding method and equipment Orthogonal bonding method and equipment

1988-03-29

1989-08-22

Jordan, M.

Metal fusion bonding

Process

Plural joints

228 11, B23K 3102

Patent

active

048588199

ABSTRACT:
Wire bonds are closely spaced about the edge of a semiconductor chip device (150) in an orthogonal array. Even though the wires may have a fan out pattern to their second bond locations, close spacing of the first bond pads is achieved by use of rectangular pads (154) having their long dimensions all perpendicular to the chip edge, making all of the first bonds along lines perpendicular to the chip edge and then bending the wire to extend to the second bond.

REFERENCES:
patent: 3257704 (1966-06-01), Hafner
patent: 3289452 (1966-12-01), Kollner
patent: 4327860 (1982-05-01), Kirshenboin et al.
patent: 4378902 (1983-04-01), Fedak
patent: 4445633 (1984-05-01), Bonham
patent: 4597522 (1986-07-01), Kobayashi
patent: 4732313 (1988-03-01), Kobayashi et al.

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