Orthogonal bonding method and equipment

Details Orthogonal bonding method and equipment Orthogonal bonding method and equipment

1989-04-26

1992-02-25

Picard, Leo P.

Electricity: electrical systems and devices

Miscellaneous

357 68, 357 70, 361403, H01R 900

Patent

active

050918257

ABSTRACT:
Wire bonds are closely spaced about the edge of a semiconductor chip device (150) in an orthogonal array. Even though the wires may have a fan out pattern to their second bond locations, close spacing of the first bond pads is achieved by use of rectangular pads (154) having their long dimensions all perpendicular to the chip edge, making all of the first bonds along lines perpendicular to the chip edge and then bending the wire to extend to the second bond.

REFERENCES:
patent: 4363076 (1982-12-01), McIver
patent: 4437141 (1984-03-01), Prokop
patent: 4812949 (1989-03-01), Fontan et al.
patent: 4949453 (1990-08-01), Neumann et al.
patent: 4959900 (1990-10-01), De Givry et al.

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