Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2007-05-29
2007-05-29
Le, Thao X. (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S106000, C257SE21505
Reexamination Certificate
active
10888169
ABSTRACT:
An electronic apparatus comprising one or more microstructures on a substrate and a method for fabricating the electronic apparatus. The microstructures have alignment structures that allow the microstructures to be oriented in receptacles having shapes that are complementary to the shapes of the alignment structures. The alignment structures are shapes that vary when rotated 360°, such that the microstructures are positioned at a specific orientation in the receptacles.
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Hafiz Mursalin B.
HRL Laboratories LLC
Ladas & Parry
Le Thao X.
LandOfFree
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