Organosilane adhesion promotion in manufacture of additive print

Details Organosilane adhesion promotion in manufacture of additive print Organosilane adhesion promotion in manufacture of additive print

1993-02-03

1995-01-31

Beck, Shrive

Stock material or miscellaneous articles

Composite

Of silicon containing

427 96, 427 98, 427304, 427305, 428446, 428450, B05D 100

Patent

active

053857879

ABSTRACT:
The metal (for example, copper) to base material adhesion in an additive printed wiring board is improved by contacting the base material with a solution containing a ureidosilane, preferably also comprising a disilyl crosslinking agent, followed by drying the solution to remove solvent, before contacting the base material with an activating agent for an electroless deposition step. Heating of the board, after the deposition of the metal, for example by baking in an oven or in an autoclave, gives the highest level of adhesion between metal and base material.

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C. F. Coombs, Jr., "Additive Plating", Chapter 13, in Printed Circuits Handbook, 3rd Ed., pp. 13.1-13.18 (1988).

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