Organopolysiloxane composition and process for producing cured p

Compositions – Electrically conductive or emissive compositions – Elemental carbon containing

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252513, 252514, 528 15, 528 31, 524431, 524432, 524440, 524441, 524266, 524268, 524588, B29C 4500

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active

053840755

ABSTRACT:
An addition-curable type organopolysiloxane composition having a volume resistivity of 10.sup.7 .OMEGA.cm or below, comprising (A) an organopolysiloxane having at least two alkenyl group in its molecule and a viscosity at 25.degree. C. of from 100 to 200,000 cSt, (B) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in its molecule, (C) a platinum group metal catalyst, (D) an organosilicon compound which has at least one silicon-bonded hydrogen atom in its molecule and in which at least one member selected from the group consisting of epoxy group-containing organic groups and alkoxy groups is attached to a silicon atom, and (E) an electrically conductive filler. This composition can be cured by an ultra high frequency heating system to form an adhesive cured product. It is therefore possible to obtain cured products with stable physical properties under constantly fixed conditions irrespective of the heat capacity of adherends.

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patent: 4604424 (1986-08-01), Cole et al.
patent: 4777205 (1988-10-01), La Scola
patent: 5104919 (1992-04-01), Okami et al.
patent: 5209872 (1993-05-01), Takahashi et al.
patent: 5217651 (1993-07-01), Nagaoka

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