Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate
2008-05-13
2008-05-13
Tran, Thien F (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
Passive components in ics
C257S535000, C257SE27048
Reexamination Certificate
active
07372126
ABSTRACT:
A thin-film capacitor assembly includes two plates that are accessed through deep and shallow vias. The thin-film capacitor assembly is able to be coupled with a spacer and an interposer. The thin-film capacitor assembly is also able to be stacked with a plurality of thin-film capacitor assemblies. The thin-film capacitor assembly is also part of computing system.
REFERENCES:
patent: 4890192 (1989-12-01), Smith
patent: 5745334 (1998-04-01), Hoffarth et al.
patent: 5800575 (1998-09-01), Lucas
patent: 6236102 (2001-05-01), Kim et al.
patent: 6339527 (2002-01-01), Farooq et al.
patent: 6368514 (2002-04-01), Metzler
patent: 6433993 (2002-08-01), Hunt et al.
patent: 6448628 (2002-09-01), Chern et al.
patent: 6459117 (2002-10-01), Liou
patent: 6477036 (2002-11-01), Kitagawa et al.
patent: 6605515 (2003-08-01), Kitagawa et al.
patent: 6739027 (2004-05-01), Lauffer et al.
patent: 6749928 (2004-06-01), Takaya et al.
patent: 6754952 (2004-06-01), Takano et al.
patent: 6897508 (2005-05-01), Sneh
patent: 6910266 (2005-06-01), Lee et al.
patent: 6928726 (2005-08-01), Zollo et al.
patent: 7027289 (2006-04-01), He et al.
patent: 7288459 (2007-10-01), Guzek et al.
patent: 2001/0019144 (2001-09-01), Roy
patent: 2004/0196620 (2004-10-01), Knudsen et al.
patent: 2004/0257749 (2004-12-01), Otsuka et al.
patent: 2005/0269128 (2005-12-01), Usui et al.
patent: 2006/0143886 (2006-07-01), Srinivasan et al.
patent: 2006/0223226 (2006-10-01), Guzek et al.
“U.S. Appl. No. 11/095,917 Non-Final Office Action mailed Oct. 19, 2006”, 5 pgs.
“U.S. Appl. No. 11/095,917 Notice of Allowance mailed Mar. 23, 2007”, 5 pgs.
“U.S. Appl. No. 11/095,917 Notice of Allowance mailed Jun. 18, 2007”, 5 pgs.
“U.S. Appl. No. 11/095,917 Response filed Jan. 31, 2007 in response to Non-Final Office Action mailed Oct. 19, 2006”, 10 pgs.
Guzek John S.
Palanduz Cengiz A.
Prokofiev Victor
Intel Corporation
Schwegman Lundberg & Woessner, P.A.
Tran Thien F
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