Organic substrate with integral thermal dissipation...

Details Organic substrate with integral thermal dissipation... Organic substrate with integral thermal dissipation...

2007-11-20

2007-11-20

Gandhi, Jayprakash (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S699000, C361S720000, C174S015100, C174S016100, C174S252000

Reexamination Certificate

active

11427382

ABSTRACT:
A chip module heat transfer apparatus includes one or more chips electronically connected to a module substrate by controlled collapse chip connection (C4) solder joints. The module substrate, which is preferably an FR-4 laminate or other organic substrate, has cut-out channels formed thereon. A permanent solder mask is laminated over the cut-out channels to form thermal dissipation channels, which are in fluid communication with input and output ports. The C4 solder joints include solder balls that electronically connect terminals on the chips to corresponding attach pads on the substrate that are exposed through the mask. The thermal dissipation channels extend along rows of attach pads. A cooling fluid, such as inert perfluorocarbon fluid, flows through the thermal dissipation channels to remove heat and to mitigate strain on the solder balls due to coefficient of thermal expansion (CTE) mismatch between the chips and the substrate.

REFERENCES:
patent: 4774630 (1988-09-01), Reisman et al.
patent: 5142441 (1992-08-01), Seibold et al.
patent: 5787974 (1998-08-01), Pennington
patent: 5929518 (1999-07-01), Schlaiss
patent: 6377457 (2002-04-01), Seshan et al.
patent: 6708871 (2004-03-01), Pierson
patent: 7139172 (2006-11-01), Bezama et al.
patent: 7190580 (2007-03-01), Bezama et al.
Miller et al., “A Novel Strategy for the Integration of PDMS Membranes into Thermoplastic Microfluidic Packages”, IEEE 55th Electrical Components and Technology Conference, Lake Buena Vista, Flordia, May 31-Jun. 3, 2005, pp. 597-602.

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