Organic space holder for trench processing

Fishing – trapping – and vermin destroying

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Details

437 52, 437203, 437228, 437229, H01L 21312, H01L 21336

Patent

active

049450697

ABSTRACT:
A void (60) is created in a semiconductor substrate (52) by forming a cavity which is subsequently filled with an organic polymer (66). The organic polymer is masked and etched to form a spacer. A dielectric (70) fills the portions of the cavity where the organic polymer was etched away. The organic polymer is subsequently etched leaving a void.

REFERENCES:
patent: 4683486 (1987-07-01), Chatterjee
patent: 4790903 (1988-12-01), Sugano et al.

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