Organic solid substrate dewatering process based on plug flow co

Drying and gas or vapor contact with solids – Apparatus – With means to treat gas or vapor

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Details

210476, F26B 300, B01D 2300

Patent

active

043971008

ABSTRACT:
A method of removing water from organic solid substrates, such as peat, wherein a primary solvent is used to extract water from the substrate and the primary solvent and the substrate are kept in plug flow during contact, and then a secondary solvent may be used to separate the primary solvent from the water.

REFERENCES:
patent: 3327402 (1967-06-01), Lamb et al.
patent: 4026790 (1977-05-01), Moore
patent: 4339882 (1982-07-01), Dickey et al.

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