Organic solderability preservative compositions

Details Organic solderability preservative compositions Organic solderability preservative compositions

1997-07-29

1999-01-12

Green, Anthony

Compositions: coating or plastic

Coating or plastic compositions

Corrosion inhibiting coating composition

106 1415, 106 1416, 106 1441, 106 1443, 252390, 252391, 252392, C23F 1100, C08K 516

Patent

active

058580743

ABSTRACT:
Known organic solderability preservatives (OSP) contain an azole compound and are applied on a copper surface from an acidic solution. The OSPs are not visible to the naked eye when applied. A number of dyes compatible with the OSP solution and not interfering with solderability has been identified. The composition containing such a dye can produce a layer which is visible to the naked eye when applied even in a thin layer. The suitable dyes contain a cationic imine group having the general formula ##STR1## where X.sup.- is an anion such as chloride, iodide, sulphate, etc., or an organically bonded anionic group such as sulphonate.

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Artaki et al., Corrosion Protection . . . Circuit World, vol. 19, No. 3, pp. 40-45, 1993 no month.

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