Organic semiconductor element with shield layer

Details Organic semiconductor element with shield layer Organic semiconductor element with shield layer

2005-06-10

2011-12-06

Guharay, Karabi (Department: 2889)

Electric lamp and discharge devices

With luminescent solid or liquid material

Solid-state type

C313S506000

Reexamination Certificate

active

08072138

ABSTRACT:
An organic semiconductor element part formed on a substrate is covered with a planarizing layer, a radiator plate is fixed with an adhesive layer on the planarizing layer, and a shield layer intercepting the adverse effects exerted on the organic semiconductor element part during the curing of the adhesive layer is formed between the adhesive layer and the planarizing layer. When the adhesive layer is a photo-curing adhesive layer, the shield layer prefers to intercept the light used for curing the photo-curing adhesive layer. When the adhesive layer is a thermosetting adhesive layer, the shield layer prefers to intercept the outgassing occurring during the curing of the thermosetting adhesive layer. By adopting this configuration, it is made possible to accomplish infallible interception of oxygen and moisture and effect radiation of heat with high efficiency. It is further made possible to suppress the adverse effect induced during the adhesion of the radiator plate and prevent the organic semiconductor element part (organic EL element) from being deteriorated.

REFERENCES:
patent: 2003/0017297 (2003-01-01), Song et al.
patent: 2004/0054053 (2004-03-01), Mori
patent: 2004/0212759 (2004-10-01), Hayashi
patent: 2005/0084214 (2005-04-01), Hayashi et al.
patent: 2006/0061272 (2006-03-01), McCormick et al.
patent: 2000-068050 (2000-03-01), None
patent: 2004-039468 (2004-02-01), None
JP200068050 Komaki et al., Transaltion.

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