Organic optoelectronic device

Active solid-state devices (e.g. – transistors – solid-state diode – Organic semiconductor material

Reexamination Certificate

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C257SE51017, C257SE51018

Reexamination Certificate

active

08049207

ABSTRACT:
A method for manufacturing an organic electronic device including a stack of layers including a release layer, the stack having a lateral structure on a substrate, at least one of the layers being an organic material layer. A method includes with the step of providing a stamp with at least one protrusion of the surface area corresponding to the lateral structure. The stack of layers is deposited with a first face on the surface area of the protrusion of the stamp. A second face of the stack that is opposite to the first face is brought into adhesive contact with the substrate. The stamp is released from the stack.

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patent: 2004/0245923 (2004-12-01), Park et al.
patent: 2006/0027117 (2006-02-01), Cavallini et al.
Bietsch et al. “Conformal Contact and Pattern Stability of Stamps Used for Soft Lithography”, Journal of Applied Physics, vol. 88, No. 7, Oct. 2000, pp. 4310-4318.
Michel et al. “Printing Meets Lithography: Soft Approaches to High-Resolution Patterning”, IBM Journal of Research and Development, vol. 45, No. 5, Sep. 2001, pp. 697-719.
Schmid et al. “Siloxane Polymers for High-Resolution, High-Sccuracy Soft Lithography”, Macromolecules, Mar. 25, 2000, Abstract.
USPTO U.S. Appl. No. 11/214,334, filed Aug. 29, 2005 to Siefried F. Karg et al, entitled “Organic Optoelectronic Device”, Office Action dated Jun. 27, 2007.
USPTO U.S. Appl. No. 11/214,334, filed Aug. 29, 2005 to Siefgried F. Karg et al., entitled “Organic Optoelectronic Device”, Notice of Allowance/Supplemental Notice of Allowance dated Aug. 8, 2007 and Oct. 25, 2007 respectively.

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