Organic-metallic composite coating for copper surface protection

Details Organic-metallic composite coating for copper surface protection Organic-metallic composite coating for copper surface protection

1996-12-18

1999-09-28

Dudash, Diana

Stock material or miscellaneous articles

All metal or with adjacent metals

Having metal particles

106 1417, 106 1442, 106 1444, 228205, 228207, 228208, 228209, 22826261, 427 96, 427203, 427205, 427353, 427328, 427384, 427405, 4274198, 428901, 428548, 428553, B22F 100, B05D 136, B05D 300, B05D 714

Patent

active

059602511

ABSTRACT:
Copper-containing surfaces of substrates such as laminated electronic circuit boards are protected by organometallic coatings comprising organic compounds selected from the group consisting of benzimidazoles, alkylimidazoles, benzotriazozles and alkyltriazoles, substituted or unsubstituted, and metal particles of solder-wettable metals or metal solders. The metal particles can be thermally formed in situ from metallic compounds such as noble metal acetates, acetylacetonates and carbonates.

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