Organic electronic package and method of applying palladium-tin

Details Organic electronic package and method of applying palladium-tin Organic electronic package and method of applying palladium-tin

1997-12-17

2000-02-15

Speer, Timothy

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

430 14, 430 16, 430 18, 427305, 428901, 174258, B32B 900

Patent

active

060250577

ABSTRACT:
A method of fabricating an electronic package having an organic substrate. The substrate is formed of fiberglass and epoxy. In order to additively circuitize the electronic package substrate, an organic polyelectrolyte is deposited onto the organic substrate. A colloidal palladium-tin seed layer is deposited atop the organic polyelectrolyte. This is followed by depositing a photoimageable polymer atop the seed layer, and photolithographically patterning the photoimageable polymer to uncover portions of the seed. layer. The uncovered portions of the seed layer are catalytic to the electroless deposition of copper. In this way a conductive layer of copper is deposited atop the uncovered seed layer. The organic polyelectrolyte is deposited from an aqueous solution at the pH appropriate for the desired seed catalyst coating, depending on the ionizable character of the particular polyelectrolyte employed.

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