Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2005-08-23
2005-08-23
Compton, Eric (Department: 3726)
Metal working
Method of mechanical manufacture
Electrical device making
C029S830000, C029S831000, C029S846000
Reexamination Certificate
active
06931723
ABSTRACT:
A method for making a multi-layer electronic structure. A layer of dielectric material having a top surface and a bottom surface is provided. A layer of electrically conducting material is provided on one of the top surface and the bottom surface of the dielectric layer. At least one passage is formed through the dielectric layer to expose the layer of electrically conducting material. Electrically conducting material is deposited in at least one of the at least one passage through the dielectric layer. Portions of the layer of electrically conducting material are removed to define a pattern of circuitry. A stack is formed of plurality of structures including the layer of dielectric material and layer of electrically conducting material. The plurality of structures are aligned and joined together. Spaces between the structures are filled with electrically insulating material.
REFERENCES:
patent: 3077511 (1963-02-01), Bohrer et al.
patent: 3311966 (1967-04-01), Shaheen et al.
patent: 3464855 (1969-09-01), Shaheen et al.
patent: 3601523 (1971-08-01), Arndt
patent: 4353957 (1982-10-01), Rutt et al.
patent: 4383363 (1983-05-01), Hayakawa et al.
patent: 4854038 (1989-08-01), Wiley
patent: 4915983 (1990-04-01), Lake et al.
patent: 4921157 (1990-05-01), Dishon et al.
patent: 5075965 (1991-12-01), Carey et al.
patent: 5108785 (1992-04-01), Lincoln et al.
patent: 5129142 (1992-07-01), Bindra et al.
patent: 5191174 (1993-03-01), Chang et al.
patent: 5229550 (1993-07-01), Bindra et al.
patent: 5376326 (1994-12-01), Medney et al.
patent: 5435057 (1995-07-01), Bindra et al.
patent: 5481795 (1996-01-01), Hatakeyama et al.
patent: 5509200 (1996-04-01), Frankeny et al.
patent: 5635010 (1997-06-01), Pepe et al.
patent: 5707749 (1998-01-01), Katagiri et al.
patent: 5729896 (1998-03-01), Dalal et al.
patent: 5731047 (1998-03-01), Noddin
patent: 5744285 (1998-04-01), Felten et al.
patent: 5744758 (1998-04-01), Takenouchi et al.
patent: 5745333 (1998-04-01), Frankeny et al.
patent: 5789121 (1998-08-01), Cywar et al.
patent: 5822856 (1998-10-01), Bhatt et al.
patent: 5837119 (1998-11-01), Kang et al.
patent: 5841099 (1998-11-01), Owen et al.
patent: 5876842 (1999-03-01), Duffy et al.
patent: 6054761 (2000-04-01), McCormack et al.
patent: 2203290 (1988-10-01), None
patent: 8274466 (1996-10-01), None
patent: WO 9820537 (1998-05-01), None
Compton Eric
Connolly Bove & Lodge & Hutz LLP
Kaschak Ronald
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