Organic compounds -- part of the class 532-570 series – Organic compounds – Oxygen containing
Reexamination Certificate
2006-05-23
2006-05-23
Barts, Samuel (Department: 1621)
Organic compounds -- part of the class 532-570 series
Organic compounds
Oxygen containing
C568S728000, C204S157600
Reexamination Certificate
active
07049475
ABSTRACT:
Ascorbic acid and/or ascorbic acid salt is made to act together with oxygen on an organic compound. Alternatively, light radiation is applied during chemical action with oxygen so as to improve a composition efficiency of an organic compound and obtain a preferable decomposition amount. This reduces the load caused by an organic compound decomposition on the environment.
REFERENCES:
patent: 3699175 (1972-10-01), Coyle
patent: 4216288 (1980-08-01), Crivello
patent: 5004551 (1991-04-01), Sublette
patent: 5252722 (1993-10-01), Mandai et al.
patent: 6245822 (2001-06-01), Terada et al.
patent: 6483006 (2002-11-01), Sekiguchi et al.
patent: 42 09 180 (1993-09-01), None
patent: 195 20 289 (1997-02-01), None
patent: 61158797 (1986-07-01), None
patent: 05194294 (1993-08-01), None
patent: 09278613 (1997-10-01), None
patent: 10-84947 (1998-04-01), None
patent: 10-230243 (1998-09-01), None
patent: 11-309342 (1999-11-01), None
patent: WO 200048968 (2000-08-01), None
Holtz, Chem. Abstr. 31:6618 a-c (1931).
Holtz, Z. physiol. Chem., vol. 248, pp. 5-20 (1937).
Roberts, “Basic Principles of Organic Chemistry,” 1005-1007 (1964).
Abstract of JP-5-345,189 (1983).
Abstract of JP-11-290,867 (1999).
Office Action of May 28, 2004 relating to JP 09-278613.
Barts Samuel
Kananen Ronald P.
Rader & Fishman & Grauer, PLLC
Sony Corporation
LandOfFree
Organic compound decomposing method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Organic compound decomposing method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Organic compound decomposing method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3626473