Stock material or miscellaneous articles – Composite – Of silicon containing
Reexamination Certificate
2006-05-23
2006-05-23
Moore, Margaret G. (Department: 1712)
Stock material or miscellaneous articles
Composite
Of silicon containing
C528S396000, C528S397000, C525S050000
Reexamination Certificate
active
07049005
ABSTRACT:
The present invention provides a composition comprising:(a) thermosetting component comprising (1) optionally monomer of Formula I as set forth below and (2) at least one oligomer or polymer of Formula II set forth below where E is a cage compound (defined below); each Q is the same or different and selected from aryl, branched aryl, and substituted aryl wherein the substituents include hydrogen, halogen, alkyl, aryl, substituted aryl, heteroaryl, aryl ether, alkenyl, alkynyl, alkoxyl, hydroxyalkyl, hydroxyaryl, hydroxyalkenyl, hydroxyalkynyl, hydroxyl, or carboxyl; G is aryl or substituted aryl where substituents include halogen and alkyl; h is from 0 to 10; i is from 0 to 10; j is from 0 to 10; and w is 0 or 1;(b) adhesion promoter comprising compound having at least bifunctionality wherein the bifunctionality may be the same or different and the first functionality is capable of interacting with the thermosetting component (a) and the second functionality is capable of interacting with a substrate when the composition is applied to the substrate.The present compositions may be used as a dielectric substrate material, etch stop, hardmask, or air bridge in microchips, multichip modules, laminated circuit boards, or printed wiring boards. The present composition may also be used as a passive coating for enveloping a completed wafer.
REFERENCES:
patent: 5347063 (1994-09-01), Shen et al.
patent: 6552143 (2003-04-01), Funaki et al.
patent: 2000100808 (2000-04-01), None
Apen Paul G.
Bedwell William B.
Iwamoto Nancy
Korolev Boris A.
Lau Kreisler S.
Bingham McCutchen
Honeywell International , Inc.
Moore Margaret G.
Thompson Sandra P.
Zimmer Marc S
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