Organic binder removal using CO.sub.2 plasma

Details Organic binder removal using CO.sub.2 plasma Organic binder removal using CO.sub.2 plasma

1987-03-23

1988-09-20

Morgenstern, Norman

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 96, 4273762, 4273763, 156643, B05D 306, B05D 512, B05D 302, B05D 21306

Patent

active

047724889

ABSTRACT:
An improved method of fabricating thick film dielectrics and copper conductors comprises depositing and drying an appropriate thick-film ink, treating the resulting patterned layer with a carbon dioxide plasma until substantially all of the organic vehicle is removed therefrom and then firing the layer in an inert atmosphere. In an alternate embodiment, a dried dielectric ink is initially treated with an oxygen plasma until about 75 to 99 percent of the vehicle is removed. Multilayer copper-based circuit structure fabricated utilizing the subject method are characterized by excellent integrity of the dielectric layers.

REFERENCES:
patent: 4619836 (1986-10-01), Prabhu et al.

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