Optoelectronic waveguiding device, structural body including...

Coherent light generators – Particular temperature control – Heat sink

Reexamination Certificate

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C372S044010, C372S046010, C385S014000

Reexamination Certificate

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10608011

ABSTRACT:
The semiconductor optical device is mounted junction down on a mounting plate via the solder metal of the mounting plate. The electrode of the semiconductor optical device facing the mounting plate is partially coated with a dielectric film and the dielectric film is in contact with the solder metal on the mounting plate.The reaction between the semiconductor optical device and the solder metal of the mounting plate can be suppressed without deteriorating the thermal conductivity between the semiconductor optical device and the mounting plate. Therefore, it is possible to improve the reliability of the semiconductor optical device mounted in the junction down form since diffusion of the solder metal into the semiconductor can be prevented.

REFERENCES:
patent: 4161701 (1979-07-01), Takeda et al.
patent: 5729561 (1998-03-01), Hironaka
patent: 6404792 (2002-06-01), Yamamoto et al.
patent: 6967980 (2005-11-01), Kawai
patent: 2001/0032985 (2001-10-01), Bhat et al.
patent: 11-87849 (1999-03-01), None
patent: 2001-144381 (2001-05-01), None
patent: 2002-204030 (2002-07-01), None
1997 General Conference of the Institute of Electronics, Information and Communication Engineers, Proceedings, Lecture Nos. C3-65.
1997 General Conference of the Institute of Electronics, Information and Communication Engineers, Proceedings, Lecture Nos. C3-68.
Journal of Electronics Materials, vol. 27, No. 2, 1998, pp. 89-95.

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