Optoelectronic sensor device

Radiant energy – Photocells; circuits and apparatus – Housings

Reexamination Certificate

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Details

C250S221000, C235S462430

Reexamination Certificate

active

06794639

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The invention relates to an optoelectronic sensor device with a housing, especially an optical proximity switch, such as a reflex light momentary contact switch or a sensor device for a one-way or reflected light photoelectric barrier. These optical proximity switches have light-emitting components, typically diodes, and preferably laser diodes as the transmitting components. Receiving components are generally large-area photodiodes. These optical proximity switches can be divided essentially into three different types, specifically into one-way systems, reflection systems, and momentary contact switch systems.
2. Description of Related Art
One way systems consist, on the one hand, of a transmitter device, and on the other, of a receiver device which is spatially separate from it. The transmitter device and the receiver device are arranged opposite one another on the side boundaries of the area to be monitored, such that light emitted by the transmitter device can be received by the receiver device. In contrast, in reflection systems, the transmitters and receivers are integrated into a single unit, therefore a single device. One such unit which represents a transmitter/receiver device is located on the outer boundary of the area to be monitored, while on the other boundary of the area to be monitored, which is opposite it, there is a reflector which reflects back the light emitted by the transmitter/receiver device onto it such that it can be received by the receiver which is integrated into the transmitter/receiver device. It is common to the two above described systems that the receiver does not receive a light signal or at least receives a reduced light signal when an object is located in the area to be monitored, since this object completely or at least partially interrupts the beam path of the light emitted by the transmitter.
Basically, different from this mode of operation is the mode of operation of optoelectronic momentary contact switch systems. In these systems, the transmitter and the receiver are, likewise, together in one unit, but there is no reflector as a component of the system. Instead, the light emitted by the transmitter in the transmitter/receiver device is reflected on the object to be detected. If at least part of this light reflected on the object to be detected is incident back on the transmitter/receiver device, this reflected light portion can be detected by the receiver.
However, in all three types of optoelectronic sensor systems, it is necessary to exactly align the optoelectronic sensor devices during their installation so that the light emitted by the transmitter is incident either directly or via reflection on the receiver. In addition, it can be necessary for the optoelectronic sensor device to be mounted in an area of the system which is only poorly accessible and/or offers only little space for mounting.
In particular, if only little space is available for the installation of the optoelectronic sensor device, and under certain circumstances, there is only one possible arrangement or orientation of the optoelectronic sensor device, it is desirable to have an optoelectronic sensor device which enables emission of light in different directions or reception of light from different directions. Accordingly, in one such optoelectronic sensor device the orientation of the transmitting and receiving unit can be adapted accordingly. At least it must be ensured that, in terms of external shape, essentially the same optoelectronic sensor devices are available in which there are receiving and transmitting units on different sides. But here, for production engineering reasons and reasons of storage, it is desirable not to produce a host of different optoelectronic sensor devices and to have to store them in order to meet the aforementioned requirements.
German Patents DE 32 22 954 C2 and DE 196 09 238 C2 disclose optoelectronic sensor devices in which, on the housing of the optoelectronic sensor device, there is a housing attachment which can be turned relative to the housing, and in this way, enables emission or reception of light from different directions. Admittedly, with these optoelectronic sensor devices, in the installed state, adaption to the spatial installation and transmitting and receiving conditions can be achieved, but these optoelectronic sensor devices are not compact devices as a result of the additional attachment. The additional attachment is, moreover, mechanically complex and susceptible to damage.
SUMMARY OF THE INVENTION
Accordingly, a primary object of the present invention is to devise an optoelectronic sensor device which can be produced as a compact unit and with the same external dimensions can be matched to different installation situations, especially can have the receiver or the transmitter on different sides.
The optoelectronic sensor device in accordance with the invention which achieves the aforementioned object is characterized in that, in the housing, there are an optics module and an electronics module. Therefore, this means that the housing, on the one hand, has an optics module for holding optical components, such as polarizers, lenses, mirrors, and diaphragms, and on the other hand, has an electronics module which has the electronics necessary for the optoelectronic sensor device so that the optics module is free of electronic components.
By separating and dividing the components necessary for the optoelectronic sensor device into the optics module, on the one hand, and the electronics module, on the other, a type of modular system is accomplished. This means that, depending on the requirements for the optoelectronic sensor devices, especially depending on the direction of light emission or reception which is necessary based on the installation situation of the optoelectronic sensor devices, at outside dimensions which are the same each time, specifically with the same housing, optoelectronic sensor devices with a transmitter and a receiver on different sides are available, and they can be produced from a small number of components which can be installed differently. In the simplest case, one such sensor device according to the invention can be built using an optics module and an electronics module which are installed in the housing, depending on the installation position of the optoelectronic sensor device, in different orientations. In an essentially rectanguloidal optoelectronic sensor device with one narrow side and one wide side, thus, there can be an optics module both for emission and reception of light on the narrow side and also alternatively on the wide side.
As stated above, the optoelectronic sensor device under consideration has a transmitter, which is preferably made as a laser diode, and/or a receiver, which is preferably made as a large-area photodiode. When the optoelectronic sensor device has a transmitter, it is provided, according to one preferred development of the invention, that the transmitter is located in a receiving device which is provided in the optics module. In this way, on the one hand, very simple installation of the transmitter in the optics module is achieved, and on the other hand, when the transmitter is installed in the optics module, accurate positioning and secure retention of the transmitter in the optics module are ensured. When the optoelectronic sensor device has a receiver, it can likewise be located in the optics module; this has similar advantages to those described above with respect to the transmitter.
According to one preferred development of the invention, however, it is provided that the receiver is part of the electronics module. Especially in the case of a large-area photodiode as the receiver, an especially simple and mechanically less susceptible electrical connection of the receiver is possible, and in addition, it is possible to check and/or adjust the complete electronics unit before installation in the housing. Thus, an already completely checked electronics module can be installed in the housing. In

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