Optoelectronic packaging substrate and production method of...

Details Optoelectronic packaging substrate and production method of... Optoelectronic packaging substrate and production method of...

2005-06-21

2005-06-21

Ullah, Akm Enayet (Department: 2874)

Optical waveguides

Integrated optical circuit

C385S131000

Reexamination Certificate

active

06909818

ABSTRACT:
The present invention provides an optoelectronic packaging substrate comprising optical wiring having an optical waveguide and electric wiring having a metal wiring and characterized in that the optical waveguide is composed of a core layer, a side face clad layer formed in the side circumference of the core layer, an upper clad layer formed on the upper side of the core layer and the side face clad layer, and a lower clad layer formed on the lower side of the core layer and the side face clad layer; that the metal wiring is formed in at least one of the side face clad layer, the upper clad layer, and the lower clad layer; and that the core layer, the side face clad layer, and the clad layer bearing the metal wiring are made of a silicon-based material layer of a branched type polysilane mixed with a silicone compound.

REFERENCES:
patent: 5347601 (1994-09-01), Ade et al.
patent: 6027254 (2000-02-01), Yamada et al.
patent: 6031945 (2000-02-01), You et al.
JP 10-326957, A and English abstract thereof.
JP 6-22234, A and English abstract thereof.
JP 6-291273, A and English abstract thereof.
JP 7-114188, A and English abstract thereof.
JP 5-72694, A and English abstract thereof.
JP 57-11339, A and English abstract thereof.

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