Optoelectronic packaging assembly

Details Optoelectronic packaging assembly Optoelectronic packaging assembly

2006-06-27

2006-06-27

Palmer, Phan (Department: 2874)

Optical waveguides

With disengagable mechanical connector

Optical fiber to a nonfiber optical device connector

C385S093000, C398S141000, C174S050510

Reexamination Certificate

active

07066660

ABSTRACT:
An optoelectronics packaging assembly is provided having a ceramic base on which is connected an optoelectronics device. The optoelectronic device is maintained in an enclosure formed by a housing, the base and/or other structures. The packaging assembly includes means for placing the base and the optoelectronics device in electrical communication with an external component, for example, a printed circuit board. The means include solder balls, J-shaped leads, bent leads, and electrical pads.

REFERENCES:
patent: 5953355 (1999-09-01), Kiely et al.
patent: 6567435 (2003-05-01), Scott et al.
patent: 6632029 (2003-10-01), Williamson, III et al.
patent: 6670599 (2003-12-01), Wagner et al.
patent: 6867368 (2005-03-01), Kumar et al.

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