Optoelectronic package with wire-protection lid

Details Optoelectronic package with wire-protection lid Optoelectronic package with wire-protection lid

2006-12-26

2006-12-26

Ngo, Hung V. (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

With electrical device

C174S560000, C257S681000

Reexamination Certificate

active

07154053

ABSTRACT:
An optoelectronic package with a wire-protection lid is provided. An active surface of a silicon die includes a light working area. The silicon die is disposed on a substrate and electrically connected to the substrate through a plurality of bonding wires. A glass is disposed on the active surface of the silicon die. A silicon base lid with an opening is located above the substrate and connected to the glass by anodic bonding to mask the bonding wires. In addition, the opening of the silicon base lid is aligned with the light working area of the silicon die.

REFERENCES:
patent: 5635672 (1997-06-01), Kawaura
patent: 6111199 (2000-08-01), Wyland et al.
patent: 6365833 (2002-04-01), Eng et al.
patent: 6809852 (2004-10-01), Tao et al.
patent: 6956283 (2005-10-01), Peterson
patent: 2002/0023765 (2002-02-01), Sugiura et al.

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