Optoelectronic package and fabrication method

Details Optoelectronic package and fabrication method Optoelectronic package and fabrication method

2005-08-30

2005-08-30

St.Cyr, Daniel (Department: 2876)

Optical waveguides

With disengagable mechanical connector

Optical fiber to a nonfiber optical device connector

Reexamination Certificate

active

06935792

ABSTRACT:
An optoelectronic package is fabricated by a method which includes: positioning an optical device within a window of a substrate active-side up and below a top substrate surface; filling the window with an optical polymer material; planarizing surfaces of the optical polymer material and the substrate; patterning waveguide material over the optical polymer material and the substrate to form an optical interconnection path; and to form a mirror to reflect light from the optical device to the interconnection path; and forming a via to expose a bond pad of the optical device.

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U.S. Appl. No. 10/064,581, filed Jul. 29, 2002 Entitled “Method and Apparatus for Fabricating Waveguides and Waveguides Fabricated Therefrom” By L. Douglas, et al.
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A Copy of PCT Search Report Dated May 4, 2004 is enclosed.

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