Optoelectronic MCM package

Details Optoelectronic MCM package Optoelectronic MCM package

2008-03-20

2008-12-30

Healy, Brian M (Department: 2883)

Optical waveguides

With disengagable mechanical connector

Optical fiber to a nonfiber optical device connector

C385S014000, C385S092000, C398S135000, C398S139000, C438S029000, C438S031000, C257S184000

Reexamination Certificate

active

07470069

ABSTRACT:
A structure for electronics package for module packaging and a method of manufacturing a single chip module (SCM) or multi-chip module (MCM) for an opto-electronic package having an improved structure for heat dissipation and testing is disclosed. The optical transceivers are ideally located on a surface opposite to the electrical portion of the package. Variations on the module package include pluggable or socketed optical transceivers and card pacers that allow for the installation of multiple optical transceivers.

REFERENCES:
patent: 6439895 (2002-08-01), Li
patent: 6453081 (2002-09-01), Trezza et al.
patent: 6512861 (2003-01-01), Chakravorty et al.
patent: 6611635 (2003-08-01), Yoshimura et al.
patent: 7066657 (2006-06-01), Murali et al.
patent: 2005/0008303 (2005-01-01), Nishie et al.
patent: 2005/0117853 (2005-06-01), Murali et al.
patent: 2006/0078248 (2006-04-01), Sasaki et al.

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